| PART |
Description |
Maker |
| BZT52C6V2S BZT52C11S |
Planar Die Construction Ultra-Small Surface Mount Package
|
TY Semiconductor Co., Ltd
TY Semiconductor Co., L...
|
| BZT52C5V1 BZT52C43 |
Planar Die Construction
|
SHENZHEN YONGERJIA INDU...
|
| MM3Z10VS |
Planar Die Construction
|
TY Semiconductor Co., L...
|
| MMBT2222 |
Epitaxial planar die construction.
|
TY Semiconductor Co., Ltd
|
| 2KBP10M |
Glass Passivated Die Construction
|
Mospec Semiconductor
|
| MBR850 |
Guard Ring Die Construction for Transient Protection
|
Kersemi Electronic Co., Ltd.
Kersemi Electronic Co., Ltd...
|
| 1N5819-T 1N5817-B 1N5817-T 1N5818-B 1N5819-B 1N581 |
Through-Hole Schottky Rectifiers
Guard Ring Die Construction for Transient Protection
|
Diodes Incorporated
|
| MJD112L MJD112 |
EPITAXIAL PLANAR NPN TRANSISTOR (MONOLITHIC CONSTRUCTION WITH BUILT IN BASE-EMITTER SHUNT RESISTORS INDUSTRIAL USE.)
|
KEC[KEC(Korea Electronics)]
|
| MJD117L MJD117 |
EPITAXIAL PLANAR PNP TRANSISTOR (MONOLITHIC CONSTRUCTION WITH BUILT IN BASE-EMITTER SHUNT RESISTORS INDUSTRIAL USE.)
|
KEC(Korea)
KEC[KEC(Korea Electronics)]
|
| ICE65L04 |
Ultra Low-Power FPGA Known Good Die
|
SiliconBlue
|
| 1C5806 |
ULTRA FAST RECOVERY SILICON RECTIFIER DIE
|
SENSITRON[Sensitron]
|
| GBS |
Vitreous Resistors with Corrugated Ribbon, All welded construction, High power rating up to 1000 Watt, Corrugated ribbon construction aids rapid cooling
|
Vishay
|
